Richardson-based Qorvo, a manufacturer of advanced semiconductors and radio frequency solutions for mobile, infrastructure, defense/aerospace, and IoT markets, has landed a $75 million contract from the United States Navy’s State of the-art Heterogeneous Integrated Packaging (SHIP) project.
SHIP aims to establish advanced semiconductor packaging capabilities for the Department of Defense, along with commercial customers, in a next-level manufacturing facility designed to enhance the United State’s edge in technology and national security. Advanced packaging improves semiconductor performance while shrinking the size of the chip.
In a company release, Qorvo officials said the world-class facility would use innovation and collaboration to strengthen U.S. industry and provide highly skilled jobs in Richardson.
On Thursday, Nov. 5, Qorvo and James Klein, president of Qorvo’s Infrastructure and Defense products, will host U.S. Rep. Van Taylor (R-Plano) to celebrate the region’s win.
“This milestone is the culmination of six years of intensive research, development and application of our proven RF technology to fast and accurate point-of-care diagnostics,” said James Klein, president of Qorvo Infrastructure and Defense Products, the business under which the company’s biotechnology work is being done. “While our focus has been on the immunoassay market, we see potential to use this capability for molecular diagnostics, enabling a dual-use POC platform for rapid and accurate identification of infectious diseases in humans including viral pathogens.”
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